Industria News
Home / News / Industria News / Quid est in MP series cotidie eget gradu adhaesives curare structuram conducens Ceramic products?

Quid est in MP series cotidie eget gradu adhaesives curare structuram conducens Ceramic products?

I. Quod opus principium in MP series adhesives

  • Molecular structuram consilium

In MP series adhesives Adopt est organicum-inorganicis Hybrid Molecular Architecture, quorum pelagus catena est composito ex siloxane (si-o-si) et latus torquem introducit flexibile polymer coetibus. Hoc specialis structuram dat materiam Dual characteres: in inorganicis parte praebet altum temperatus resistentia (potest sustinere peccantes temperaturis supra DCCC ° C); In organicum pars maintains elasticitas et relieves internum accentus de LATERAMEN per scelerisque expansion et contractio.

  • Nano-Enhancement Technology

Addit 5-20nm aluminium cadmiae Nanoparticles ut a supplementi tempus, Nanoparticles replete hiatus in mocecular vincula, et densitate de vinculum iacuit, auctus per XL%. A tres dimensional network structuram formatur, et tondendas vires ad 18mam.

  • Chemical Bonding mechanism

Et tenaces est religata est Ceramic Matrix per tres vinculum modi:

Covalent Vinculum: Dehydration Condensatio de Silanol (Si-O) et Hydroxyl coetibus in Ceramic Superficies

Hydrogenii Bond: secundarium vinculum inter Polymer vinculum segments et Ceramic cancellos

Mechanica Interlocking: tenaces penetrat in Ceramic micropores ad formare anchoring effectus

2. ERECTIO

Euismod Indicatores

MP series

Epoxy resinae

Silicate

Operating temperatus

DCCC ℃

CLXXX ℃

DC ℃

Vinculum Fortis (MPA)

18

25

10

Curing DECREMENTUM (%)

0.3

1.8

0.5

Resistentia ad humorem et calor senescit

5

2

4

III. Structural Structural EPECTATIO

Scelerisque stabilitatem

Thermogravimetric Analysis (TGA) ostendit quod temperatus de V% pondus damnum pervenit CDXX ℃ in NITROGENIUM atmosphaera

Thermal Cycle Test (-30 ℃ ~ CCC ℃ exolvuntur C temporibus): vinculum vires retention rate> XCV%

Environmental tolerantia

Humorem et æstus Resistentia: M Horae sub LXXXV ℃ / LXXXV% RH environment, nec delaination et elit

Chemical resistentia: Post immersionem in acid (ph - et alcali (Ph10) Solutions pro XXX diebus, quod vinculum vires interitus est minus quam VIII%

Mechanica Property Optimization

Fracturam Toughness (Kic), 2.8 MPa · M¹ / ², III tempora altior quam traditional adhesives III

Lacus vitae: Post 10⁶ cycles de loading, quod crack incrementum rate est minus quam 10⁻⁷ mm / exolvuntur

Zhejiang Yisheng Nova Materia Co., Ltd.