I. Quod opus principium in MP series adhesives
- Molecular structuram consilium
In MP series adhesives Adopt est organicum-inorganicis Hybrid Molecular Architecture, quorum pelagus catena est composito ex siloxane (si-o-si) et latus torquem introducit flexibile polymer coetibus. Hoc specialis structuram dat materiam Dual characteres: in inorganicis parte praebet altum temperatus resistentia (potest sustinere peccantes temperaturis supra DCCC ° C); In organicum pars maintains elasticitas et relieves internum accentus de LATERAMEN per scelerisque expansion et contractio.
- Nano-Enhancement Technology
Addit 5-20nm aluminium cadmiae Nanoparticles ut a supplementi tempus, Nanoparticles replete hiatus in mocecular vincula, et densitate de vinculum iacuit, auctus per XL%. A tres dimensional network structuram formatur, et tondendas vires ad 18mam.
- Chemical Bonding mechanism
Et tenaces est religata est Ceramic Matrix per tres vinculum modi:
Covalent Vinculum: Dehydration Condensatio de Silanol (Si-O) et Hydroxyl coetibus in Ceramic Superficies
Hydrogenii Bond: secundarium vinculum inter Polymer vinculum segments et Ceramic cancellos
Mechanica Interlocking: tenaces penetrat in Ceramic micropores ad formare anchoring effectus
2. ERECTIO
Euismod Indicatores | MP series | Epoxy resinae | Silicate |
Operating temperatus | DCCC ℃ | CLXXX ℃ | DC ℃ |
Vinculum Fortis (MPA) | 18 | 25 | 10 |
Curing DECREMENTUM (%) | 0.3 | 1.8 | 0.5 |
Resistentia ad humorem et calor senescit | 5 | 2 | 4 |
III. Structural Structural EPECTATIO
Scelerisque stabilitatem
Thermogravimetric Analysis (TGA) ostendit quod temperatus de V% pondus damnum pervenit CDXX ℃ in NITROGENIUM atmosphaera
Thermal Cycle Test (-30 ℃ ~ CCC ℃ exolvuntur C temporibus): vinculum vires retention rate> XCV%
Environmental tolerantia
Humorem et æstus Resistentia: M Horae sub LXXXV ℃ / LXXXV% RH environment, nec delaination et elit
Chemical resistentia: Post immersionem in acid (ph - et alcali (Ph10) Solutions pro XXX diebus, quod vinculum vires interitus est minus quam VIII%
Mechanica Property Optimization
Fracturam Toughness (Kic), 2.8 MPa · M¹ / ², III tempora altior quam traditional adhesives III
Lacus vitae: Post 10⁶ cycles de loading, quod crack incrementum rate est minus quam 10⁻⁷ mm / exolvuntur